Microvia Reliability Stacking and Staggering for a Successful Design

Microvias are used to allow High Density Interconnections (HDI). However, designing with microvias began without a thorough understanding of the reliability of the HDI connections, especially when multiple-depth microvias were utilized. Watch this free webinar to learn from the Summit's VP of Technology, Gerry Pardita, when and where it is possible to stack microvias many levels deep, and where in the same design that staggering of microvias is necessary at every level.

1. How it is possible to use 3 or more stack microvias in tight pitch devices, along with staggered microvias outside the tightly pitched devices.
2. How material expansion, pitch, microvia diameter, reflow temperature, and the length of the stacked microvia contribute to the final reliability of the microvia.