On-Demand Webinar: What's New in IPC Revision F? Part II
Topics covered will include:- Background Behind Revision F
- Implications Behind the Changes
- Back Drill Depth
- Edge Plating
- Types of Embedded Cavities
- Printed Board Cavities
- Evidence of Etchback
- Total Copper Penetration / Evaluation of Etchback
- Dimples and Protrusions
- Plated Internal Layers
- Minimum Dielectric Spacing
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