Best Practices for HDI & Sub-Lamination Structures
Topics covered will include:- Unbalanced Constructions
- Foil Lamination
- Cap Core
- Buried/Blind Vias
- and More!
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Aerospace & Defense
Summit is one of the most trusted suppliers for key defense programs with advanced technologies across a wide spectrum of platforms. We maintain ITAR registration and certifications for AS9100, Nadcap, and Mil Spec.
Computing & Datacom
Summit is on the leading edge in the use of modern materials and HDI processes to meet the high-speed digital signal integrity requirements of the computing and datacom markets,
Medical
Summit has proven experience meeting the manufacturing requirements for medical electronic products including miniaturization with thin dielectrics, laser drilled vias and tight tolerances.
Semiconductor
Summit has extensive experience supporting the semiconductor industry across many applications including ATE boards, probe cards, reference boards, and substrates.