---
title: Best Practices for HDI & Sub-Lamination Structures
description: High-density interconnect (HDI) and sub-lamination PCBs provide enhanced functionality and compact designs. The success of these complex boards relies on following common best practices, however. Failure to do so can result in low yield, variations in the finished product, and, in extreme cases, make it impossible to build. This presentation will discuss important design best practices for HDI and sub-lamination structures.
---

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# Best Practices for HDI & Sub-Lamination Structures

![](https://go.summitinterconnect.com/hubfs/HDI%20Thumbnail.jpg)

**Topics covered will include:**

1. Unbalanced Constructions
2. Foil Lamination
3. Cap Core
4. Buried/Blind Vias
5. and More!

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